Building Envelope Forum
AIA Seattle’s Building Envelope Forum: Where Design Meets Performance will delve into the key challenges and innovative envelope solutions for new and existing buildings. This full-day forum will explore core topics and strategies: energy codes, technological innovations in air barriers, constructability and assembly, retrofitting, operations, and commissioning for high-performance building envelopes. Through presentations, discussions, and case-studies, participants will gain the tools to champion a more holistic approach to building envelope design with their clients and teams.
Following the forum, all participants are invited to join us for a special happy hour nearby.
Class Credits: 8 CEHs / 8 HSWs
$190 AIA members
$110 AIA associates
$190 SeaBEC, NAIOP, ASHRAE & Govt. Employees
15% Price Increase After December 2, 2014
Moderator + Speaker Line-Up: Dave Matthews | Mark Morden | Medgar Marceau | Max Wilson | Peter Ryan | Jack Pearson | Lee Durston | Ray Wetherholt | Don Brubeck | Stevan Vinci | Robert Bombino | Dave Deress | Stéphane Hoffman | and Robin Kotulka
Contact AIA Seattle Program Manager AV Goodsell.
Thanks to our 2014 Building Envelope Forum sponsors: